NEDIS CPU dzesēšanas pasta, sudraba līdz 300 °C 4 g.

This high-performance CPU thermal paste is designed to provide efficient heat transfer between the processor and the cooling system.

With thermal conductivity of 4.63 W/mK, it ensures stable temperatures even under heavy workloads.

The paste maintains its properties at temperatures up to 300 °C, making it suitable for high-performance CPUs, GPUs, and other heat-generating components.

Its low thermal resistance (< 0.01 °C) improves cooling efficiency, while the 4-gram volume is sufficient for multiple applications.

• Ideal for both professional and home PC assembly.

Technical Specifications

• Product type: Thermal paste
• Application: CPU / GPU / electronic components
• Thermal conductivity: 4.63 W/mK
• Operating temperature range: up to 300 °C
• Net weight: 4 g
• Colour: Grey
• Electrical conductivity: Non-conductive
• Consistency: Paste
• Intended use: Desktop and laptop computers